Vivo will showcase multiple products and technologies at the Mobile World Congress in Shanghai (MWC Shanghai) this 2017. Featured innovations include Under Display Fingerprint Scanning, Digital Signal Processing Photography, and DAC decoding chips for Hi-Fi.
Vivo in MWC Shanghai 2017
MWC Shanghai 2017 will follow the theme ‘The Human Element’, and will happen from June 28 to July 1, 2017. The conference expects at least 650 manufacturers in the mobile industry to attend. For Vivo, one of their notable presentations will feature the Vivo Under Display. This fingerprint scanning solution involves having a subtle scanner area under the screen, instead of having a specialized area on the phone body. This eliminates the need to design shells with the fingerprint scanner area in mind, essentially hiding it entirely.
Since the Vivo Under Display doesn’t require a physical button for the fingerprint sensor, it allows a true full-screen display and an integrated unibody and mechanical waterproofing design. This will promote innovative design in smartphone appearance
For photography, Vivo seeks to improve photo quality in various lighting setups through DSP solutions. Basically, DSP adjusts the brightness of the image to emulate what the human eye currently sees. Thus, particular lighting situations like the low light will be as clear as possible. The photography processing speed has also been greatly enhanced.
Finally, Hi-Fi audio enters new territory with Vivo’s customized DAC decoder chip. DAC focuses on perfecting audio details. Theoretically, SNR, dynamic range and distortion will improve dramatically with Vivo’s DAC technology.
New heights for smartphone Hi-Fi audio: new customized DAC decoder chip and headphone amplifier technology
Hi-Fi refers to High-Fidelity audio, and products equipped with this technology can provide the users with a high-quality music experience. Finally, the headphone amplifier innovation employs new processing technology to improve power efficiency and the overall audio experience.